i request you for the ppt on smart watch

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(13-11-2014, 06:12 PM)Guest Wrote: i request you for the ppt on smart watch

SUMMARY
Advances in technology enabled hardware has a very compact, self-contained and mobile nodes each have one or more gauges, computing and communications capabilities, and draft power smartdust and implimentation is studying whether autonomous year sensing, computing, communications, and can be packaged in a cubic millimeter of mote to form the basis of integrated, massively distributed sensor networks. It focuses on reducing the power consumption, size and cost. To build these small sensors, processors, power, and communications devices designers used technology of MEMS (Microelectromechanical systems).
Otherwise known as the smart-specks of nodes, typically the size of a grain of sand, and each knot is made up of:
1. sensors
2. Enable bidirectional wireless transmitter receiver & communication.
3. processors and control circuitory
4. power supply
The use of smart dust nodes, energy to acquire and process the sample, and then some time pass is about as small as it may be a few nanodžoulej.
Woven dust include many applications, because these small sizes, they can be dust, scattered from planes to monitor the battle or you can mix the paint at home, to create the ultimate home network sensors.


What is smart dust

Autonomous sensing and communication in a cubic millimetre
Berkeley smart dust ™ s project implimentation, led by professors all Pister products and Kahn, explores the limits on the size and the consumption of electricity in the autonomous sensor nodes. Size reduction is of the utmost importance to make the sites as an inexpensive and easy to deploy as possible. the study group is confident that it can embedded sensing, communications and computing equipment, as well as the power source, not more than a few cubic millimeters, while at the same time, achieving impressive results in terms of functionality and connectivity. Millimetre scale woven nodes is called a smart dust. This, of course, within the realm of possibility that future prototypes of smart dust may be small enough to remain suspended in the air, supported by air currents, sensing and communicating within a few hours or days at a time.
"Smart dust" â €?? Sensor-Laden computer network sites that only millimeters cubic volume. smartdust and implimentation project involves the complete sensor network node, including power supply, processor, sensor and communication mechanisms in one cubic millimeter. A Speck Of Dust.Smart dust can work for many years, given that the cubic millilitres can store 1J and battery back up with Could Be solar powered or vibrational energy source
The aim of the project is smart dust and implimentation is a millimeter-scale sensing and communication platform for massively distributed sensor networks. This device about the size of a grain of sand, and William will CONTAIN sensors, computing capacity, two-way wireless communication, as well as food. Smart dust is composed of series of circuit and micro-electro-mechanical systems (MEMS) is preparing to throw these and custom functions in Silicon. Microelectromechanical systems (MEMS) constit extremely tiny mechanical elements, together with the integrated electronic circuit frequently.

MEMS TECHNOLOGY in smart dust
Smartdust revolutionary advances in miniaturization Requires the integration and energy management. Used designers Hencse MEMS technology to create small sensors, optical communication components and power supplies. Microelectro mechanical systems consists of very small mechanical elements, along with built-in electronic Often circuitory. They are measured in microns, then there are millions of meters. They are made in the same way as computer chip. the advantage of this process is not just might be that small structures, but also that thousands or even millions of system elements, manufactured at the same time. This allows the system to be highly complex and extremely low cost.
Micro-electro-mechanical systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. While the electronics integrated circuit manufactured using IP Process sequence (for example, CMOS, bipolar processes), micromechanical components made using compatible "micromachining" which selectively stravlivaût of Silicon Wafer Processes or add new structural layers for formation of mechanical and electromechanical devices. MEMS implements a complete system on Chip technology.