ful seminar report on plasmonics-a new device for technology
ful seminar report on plasmonics-a new device for technology
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Plasmonics demonstrates how light can be guided along metallic surfaces or within nanometer thick metal films. It works like this: an atomic level, the metal crystals have a very organized lattice structure. Red contains free electrons, not closely associated with metal atoms, which interact with light than strokes.
These free electrons begin collectively to oscillate with respect to the position of the positively charged nuclei in the metal net. Like the density of air molecules in a sound wave, the electron density fluctuates in the metal lattice as a plasmon wave.
Visible light, having a wavelength of about half a micrometer, can thus be concentrated by a factor of nearly 100 to travel through metallic films of only a few nanometers (nm) in thickness. That's 1,000 times smaller than a human hair. The new mixed-state electron-wave light intensified light-matter interactions with unprecedented optical properties.
Plasmonics as a new device technology
Metal nanostructures can possess exactly the right combination of electronic and optical properties to address the problems of the fields above and realize the dream of processing speeds. The metals commonly used in electrical interconnection count as Cu and Al allow the excitation of surface plasmon-polaritons (SPPs).
From the engineering point of view, an SPP can be seen as a special type of light wave. Metal interconnections that support such expressions serve as well as tiny optical waveguides called plasmon waveguides. The notion that the normal optical diameter (light of light) of a metallic connection may be significantly smaller than the wavelength of light12 has generated significant excitation and has awakened the dream that someday we will be able to connect nanoscale electronics with Optical devices of similar size (Plasmonics).
It is important to note that, with the latest advances in electromagnetic simulations and manufacturing techniques compatible with CMOS, a variety of functional plastic structures are designed and manufactured in a Si foundation at this time. The current technology of Si-based integrated circuits uses nanoscale metal structures, such as Cu and Al interconnections, to route electronic signals between transistors on a chip. This processing technology can be used as well as our favor for integral devices with their electronic and dielectric photonic counterparts. In some cases, the plasmon waveguides can even perform a dual function and simultaneously carry both optical and electrical signals, giving rise to new and exciting.