The principal of Built-in-test and self-test has been widely applied to the design and testing of complex, mixed-signal electronic systems, such as integrated circuits (IC s) and multi fractional instrumentation [1]. A system with BIT is characterized by its ability to identify its operation condition by itself, through the testing and diagnosis capabilities built into its in structure. To ensure reliable performance, testability needs to be incorporated into the early stage of system and product design. Various techniques have been developed over the past decades to implement the BIT technique. In the semiconductor, the objective of applying BIT is to improve the yield of chip fabrication, enable robust and efficient chip testing and better scope with the increasing circuit complexity and integration density