bio oxidation a technology for sustainable air pollution control ppt ?..............etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a..............etc

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Sir plzz provide ppt on topic bio chips its quite urgent

At s4shivani723@gmail. com

Sir plzz provide ppt on topic biochips
at [email protected]

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hi this is murali. I want to give seminar on bio-chips.so please give me some information on bio-chip.plzz..............etc

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Hi 

I am Avinash a Research and Innovation Professional; would like detials on brain chip Technology ppt..............etc

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The interface between different fields is believed to be fertile ground for breakthrough research. The interface between the emerging fields of biotechnology and nanotechnology is particularly interesting. The possibilities for new fruit are diverse: biotechnology offers new approaches for self-assembly of structures at the nanoscale, while nanotechnology offers new methods for probing and accessing biological systems. In this talk, I will discuss research in this new frontier in my group, including 1) self-assembly of 2D nanocomponent arrays ..............etc

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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt..............etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan..............etc

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hai frnd.... this is really an awesome one can please mail me this presentation to [email protected]

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