18-03-2011, 04:58 PM
Presented by:
PRASHANTHI
P.PARMESHWARI
[attachment=10530]
ABSTRACT
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased. Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. They include MRAM, FeRAM, Polymer Memory and Ovonics Unified Memory. Polymer memory is the leading technology among them. It is mainly because of their expansion. capability in three dimensional spaces.
A polymer retains space charges near a metal interface when there is a bias, or electrical current, running across the surface. We can store space charges in a polymer layer, and conveniently check the presence of the space charges to know the state of the polymer layer. Space charges are essentially differences in electrical charge in a given region. They can be read using an electrical pulse because they change the way the devices conduct electricity.
1. INTRODUCTION
Imagine a time when your mobile will be your virtual assistant and will need far more than the 8k and 16k memory that it has today, or a world where laptops require gigabytes of memory because of the impact of convergence on the very nature of computing. How much space would your laptop need to carry all that memory capacity? Not much, if Intel's project with Thin Film Electronics ASA (TFE) of Sweden works according to plan. TFE's idea is to use polymer memory modules rather than silicon-based memory modules, and what's more it's going to use architecture that is quite different from silicon-based modules.
While microchip makers continue to wring more and more from silicon, the most dramatic improvements in the electronics industry could come from an entirely different material plastic. Labs around the world are working on integrated circuits, displays for handheld devices and even solar cells that rely on electrically conducting polymers—not silicon—for cheap and flexible electronic components. Now two of the world’s leading chip makers are racing to develop new stock for this plastic microelectronic arsenal: polymer memory. Advanced Micro Devices of Sunnyvale, CA,
is working with Coatue, a startup in Woburn, MA, to develop chips that store data in polymers rather than silicon. The technology, according to Coatue CEO Andrew Perlman, could lead to a cheaper and denser alternative to flash memory chips—the type of memory used in digital cameras and MP3 players. Meanwhile, Intel is collaborating with Thin Film Technologies in Linkping, Sweden, on a similar high capacity polymer memory.
2. PRESENT MEMORY TECHNOLOGY SCENARIO
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. DRAM is volatile and difficult to integrate. RAM is high cost and volatile. Flash has slower writes and lesser number of write/erase cycles compared to others. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased. They will not allow stacking of one memory chip over the other. Also the storage capacities are not enough to fulfill the exponentially increasing need. Hence industry is searching for “Holy Grail” future memory technologies for portable devices such as cell phones, mobile PC’s etc. Next generation memories are trying a tradeoffs between size and cost .This make them good possibilities for development
3. NEXT GENERATION MEMORIES
As mentioned earlier microchip makers continue to wring more and more from silicon, large number of memory technologies were emerged. These memory technologies are referred as ‘Next Generation Memories’. Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. Intel, the biggest maker of computer processors, is also the largest maker of flash-memory chips is trying to combine the processing features and space requirements feature and several next generation memories are being studied in this perspective. They include MRAM, FeRAM, Polymer Memory and Ovonics Unified Memory. Polymer memory is the leading technology among them. It is mainly because of their expansion capability in three dimensional spaces. The following graph also emphasis acceptance of Polymer memory.
PRASHANTHI
P.PARMESHWARI
[attachment=10530]
ABSTRACT
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased. Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. They include MRAM, FeRAM, Polymer Memory and Ovonics Unified Memory. Polymer memory is the leading technology among them. It is mainly because of their expansion. capability in three dimensional spaces.
A polymer retains space charges near a metal interface when there is a bias, or electrical current, running across the surface. We can store space charges in a polymer layer, and conveniently check the presence of the space charges to know the state of the polymer layer. Space charges are essentially differences in electrical charge in a given region. They can be read using an electrical pulse because they change the way the devices conduct electricity.
1. INTRODUCTION
Imagine a time when your mobile will be your virtual assistant and will need far more than the 8k and 16k memory that it has today, or a world where laptops require gigabytes of memory because of the impact of convergence on the very nature of computing. How much space would your laptop need to carry all that memory capacity? Not much, if Intel's project with Thin Film Electronics ASA (TFE) of Sweden works according to plan. TFE's idea is to use polymer memory modules rather than silicon-based memory modules, and what's more it's going to use architecture that is quite different from silicon-based modules.
While microchip makers continue to wring more and more from silicon, the most dramatic improvements in the electronics industry could come from an entirely different material plastic. Labs around the world are working on integrated circuits, displays for handheld devices and even solar cells that rely on electrically conducting polymers—not silicon—for cheap and flexible electronic components. Now two of the world’s leading chip makers are racing to develop new stock for this plastic microelectronic arsenal: polymer memory. Advanced Micro Devices of Sunnyvale, CA,
is working with Coatue, a startup in Woburn, MA, to develop chips that store data in polymers rather than silicon. The technology, according to Coatue CEO Andrew Perlman, could lead to a cheaper and denser alternative to flash memory chips—the type of memory used in digital cameras and MP3 players. Meanwhile, Intel is collaborating with Thin Film Technologies in Linkping, Sweden, on a similar high capacity polymer memory.
2. PRESENT MEMORY TECHNOLOGY SCENARIO
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. DRAM is volatile and difficult to integrate. RAM is high cost and volatile. Flash has slower writes and lesser number of write/erase cycles compared to others. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased. They will not allow stacking of one memory chip over the other. Also the storage capacities are not enough to fulfill the exponentially increasing need. Hence industry is searching for “Holy Grail” future memory technologies for portable devices such as cell phones, mobile PC’s etc. Next generation memories are trying a tradeoffs between size and cost .This make them good possibilities for development
3. NEXT GENERATION MEMORIES
As mentioned earlier microchip makers continue to wring more and more from silicon, large number of memory technologies were emerged. These memory technologies are referred as ‘Next Generation Memories’. Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. Intel, the biggest maker of computer processors, is also the largest maker of flash-memory chips is trying to combine the processing features and space requirements feature and several next generation memories are being studied in this perspective. They include MRAM, FeRAM, Polymer Memory and Ovonics Unified Memory. Polymer memory is the leading technology among them. It is mainly because of their expansion capability in three dimensional spaces. The following graph also emphasis acceptance of Polymer memory.
