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REVERSE ENGINEERING INVESTIGATING THE NANOSCALE
REVERSE ENGINEERING:
Product teardowns “ product, package, internal boards
System level analysis “ analyze operations, signal paths
Circuit extraction “ extract interconnections and components to create,delayer to transistor level
Process analysis “ examine the structure and materials
manufactured and what it is made of.
REVERSE ENGINEERING SPECIFICATION:
RE can cover objects from as large as aircraft down to the smallest microchip.
The need to RE archaic parts is to replacing in long-lived equipment such as military systems, nuclear reactors, airliners, and ships.
Reverse engineers around the world have had a significant influence on the dissemination of technology in the electronics industry.
The legislative enactments have helped to clarify the meaning of fair use in a digital age.
RE is protected in the US by the Semiconductor Chip Protection Act, which allows it
for the purpose of teaching, analyzing, or evaluating the
concepts or techniques embodied in the mask work or circuitry . . .
RE customers fall into two groups:
Technical information,
Patent-related information.
we will focus on the nanoscale reverse engineering involved in circuit extraction and manufacturing technique (process analysis).
