12-06-2012, 12:32 PM
THREE DIMENTIONAL INTEGRATED CIRCUITS
ABSTRACT:
The future of technology is in compact but faster and affordable devices that provide ability to connect anywhere, anytime with any service to get uninterrupted access to information, entertainment, communication, monitoring and control. Microminiaturization is the key to make the compact electronic devices used for high reliability in application. Latest trend in technology is to move from3D flexible configuration to 3D stacking and then to 3D ICs. There are different motivations like form factor, electrical performance and cost of 3D integration for development of 3D IC. The 3D IC technology is at research and development stage in the bigger ICcompanies today and technical issues are very close to be solved. The adoption of advanced packaging technologies could also change the industry food chain of the semiconductor. The current goal is to develop a cost effective technology tool for 3D ICs.3D integration consists of stacking integrated circuits and connecting them vertically. It replaces long vertical wiring connections by vertical interconnects .Minimum pitch of vertical interconnect had been used previously in 2007 was approximately 50µm which has been now a day reduced up to 5 µm and will reduce to less than 2 µm in near future. Application of 3Dintegration is 3D stacked memory and in future application will be in logic (multi core processor with cache memory) and vertical device on CMOS or multilevel 3D IC. This seminar discusses the latest trends in 3D ICs like TSV as well as challenges in the 3D IC technologies.