Optical Computer Full Seminar Report Download
#26
sir i need ppt of dis
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#27
please sir ,give me report on optical computre
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#28
hi
you can see these pages to get the details on optical-computer

http://studentbank.in/report-optical-com...t-download

http://studentbank.in/report-optical-com...oad?page=2

http://studentbank.in/report-optical-com...oad?page=4
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#29
[attachment=15445]
SYNOPSIS
Optical computing means performing computations, operations, storage and transmission of data using only light. It uses the photons in visible light or infrared (IR) beams, rather than electric current, to perform digital computations. Optical computers, theoretically, transmit data using light from laser or infrared beams as opposed to electronic currents. Instead of silicon chips optical computer uses organic polymers like phthalocyanine and polydiacetylene. Optical technology promises massive upgrades in the efficiency and speed of computers, as well as significant shrinkage in their size and cost. Optical computer would be extremely fast because they wouldn't need physical wires or cables to transmit data. An optical desktop computer is capable of processing data up to 1,00,000 times faster than current models.
2. INTRODUCTION
Computers have enhanced human life to a great extent. The speed of conventional computers is achieved by miniaturizing electronic components to a very small micron-size scale so that those electrons need to travel only very short distances within a very short time. The goal of improving on computer speed has resulted in the development of the Very Large Scale Integration (VLSI) technology with smaller device dimensions and greater complexity. Last year, the smallest-to-date dimensions of VLSI reached 0.08 urn by researchers at Lucent Technology. Whereas VLSI technology has revolutionized the electronics industry and established the 20th century as the computer age, increasing usage of the Internet demands better accommodation of a 10 to 15 percent per month growth rate. Additionally, our daily lives demand solutions to increasingly sophisticated and complex problems, which requires more speed and better performance of computers.
For these reasons, it is unfortunate that VLSI technology is approaching its fundamental limits in the sub-micron miniaturization process. It is now possible to fit up to 300 million transistors on a single silicon chip. It is also estimated that the number of transistor switches that can be put onto a chip doubles every 18 months. Further miniaturization of lithography introduces several problems such as dielectric breakdown, hot carriers, and short channel effects. All of these factors combine to seriously degrade device reliability. Even if developing technology succeeded in temporarily overcoming these physical problems, we will continue to face them as long as increasing demands for higher integration continues. Therefore, a dramatic solution to the problem is needed, and unless we gear our thoughts toward a totally different pathway, we will not be able to further improve our computer performance for the future.
Optical interconnections and optical integrated circuits will provide a way out of these limitations to computational speed and complexity inherent in conventional electronics. Optical computers will use photons traveling on optical fibers or thin films instead of electrons to perform the appropriate functions. In the optical computer of the future, electronic circuits and wires will be replaced by a few optical fibers and films, making the systems more efficient with no interference, more cost effective, lighter and more compact. Optical components would not need to have insulators as those needed between electronic components because they don't experience cross talk. Indeed, multiple frequencies (or different colors) of light can travel through optical components without interfacing with each others, allowing photonic devices to process multiple streams of data simultaneously.
3. NEED FOR OPTICAL COMPUTING
Optical interconnections and optical integrated circuits have several advantageous over their electronic counterparts. They are immune to electromagnetic interference, and free from electrical short circuits. They have low-loss transmission and provide large bandwidth; i.e. multiplexing capability, capable of communicating several channels in parallel without interference. They are capable of propagating signals within the same or adjacent fibers with essentially no interference or cross-talk. They are compact, lightweight, and inexpensive to manufacture, and more facile with stored information than magnetic materials.
We are in an era of daily explosions in the development of optics and optical components for computing and other applications. The business of photonics is booming in industry and universities worldwide. It is estimated that photonic device sales worldwide will range between $12 billion and $100 billion in 1999 due to an ever-increasing demand for data traffic. According to KMI corp., data traffic is growing worldwide at a rate of 100% per year, while, the Phillips Group in London estimates that the U.S. data traffic will increase by 300% annually. KMI corp. also estimates that sales of dense-wavelength division multiplexing equipment will increase by more than quadruple its growth in the next five years, i.e. from $2.2 billion worldwide in 1998 to $9.4 billion 2D04
Most of the components that are currently very much in demand are electro-optical (EO). Such hybrid components are limited by the speed of their electronic parts. All-optical components will have the advantage of speed over EO components. Unfortunately, there is an absence of known efficient nonlinear optical materials that can respond at low power levels. Most all optical components require a high level of laser power to function as required. Another group at Brown University and the IBM Almaden Research Center (San Jose, CA) have used ultra fast laser pulses to build ultra fast data storage devices. This group was able to achieve ultra fast switching down to 100ps. Their results are almost ten times faster than currently available "speed limits". Optoelectronic technologies for optical computers and communication hold promise for transmitting data as short as the space between computer chips or as long as the orbital distance between satellites. A European collaborative effort demonstrated a high-speed optical data input and output in free-space between IC chips in computers at a rate of more than 1 Tb/s. Astro Terra, in collaboration with Jet Propulsion Laboratory (Pasadena, CA) has built a 32-channel 1-Ggb/s earth-to-satellite page link with a 2000 km range. Many more active devices in development, and some are likely to become crucial components in future optical computer and networks.
The race is on with foreign competitors. NEC (Tokyo, Japan) have developed a method for interconnecting circuit boards optically using Vertical Cavity Surface Emitting Laser arrays (VCSEL). Researchers at Osaka City University (Osaka, Japan) reported on a method for automatic alignment of a set of optical beams in space with a set of optical fibers. The project had achieved 1000 interconnections per printed-circuit board, with throughput ranging from 1 to 10 Tb/s.
Optics has a higher bandwidth capacity over electronics, which enables more information to be carried and data to be processed arises because electronic communication along wires requires charging of a capacitor that depends on length. In contrast, optical signals in optical fibers, optical integrated circuits, and free space do not have to charge a capacitor and are therefore faster.
Another advantage of optical methods over electronic ones for computing is that optical data processing can be done much easier and less expensive in parallel than can be done in electronics. “Parallelism is the capability of the system to execute more than one operation simultaneously”. Electronic computer architecture is, in general, sequential, where the instructions are implemented in sequence. This implies that parallelism with electronics is difficult to construct. On the other hand, using a simple optical design, an array of pixels can be transferred simultaneously in parallel from one point to another. isolated conduction channels per mm2 would be required.
Using a simple optical design, an array of pixels can be transferred simultaneously in parallel from one point to another. To appreciate the difference between both optical parallelism and electronic one can think of an imaging system of as many as 1000x1000 independent points per mm2 in the object plane which are connected optically by a lens to a corresponding 1000x1000 points per mm2 in the image plane. For this to be accomplished electrically, a million nonintersecting and properly isolated conduction channels per mm2 would be required. Parallelism, therefore, when associated with fast switching speeds, would result in staggering computational speeds.
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#30
hi
frnds ;
my seminar topic is optical computer network.
so,dear frd do help me to my seminar topic.
can u send ur optical computer full seminar report my email id.
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#31

To get more information about the topic " Optical Computer Full Seminar Report Download " please refer the page link below

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http://studentbank.in/report-optical-com...oad?page=2

http://studentbank.in/report-optical-com...oad?page=4
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#32
HeartHeartHeart
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#33
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#34
the seminar report is awesome one!!!
very good........!!
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#35
very goood work . keep it up
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#36
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http://studentbank.in/report-optical-com...oad?page=4
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#37
more useful report of the seminars
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#38
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#39
dowload to this topic
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#40
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#41

ECE-11













A
Technical
Paper presentation
On









[EC 04]
BY

D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786





















Accredited by NBA







ECE-11







1



ECE-11


ABSTRACT







































































ECE-11







































































2



ECE-11


VLSI
Very Large Scale Integrated Circuit




Why Design Integrated Circuits?

Integrated Circuit (IC) technology is the enabling technology for a
whole host of innovative devices and systems that have changed the way we live.
Integrated circuits are much smaller and consume less power than the discrete
components used to build electronic systems before the 1960s. Integration allows
us to build systems with many more transistors, allowing much more computing
power to be applied to solving a problem. Integrated circuits are also much easier
to design and manufacture and are more reliable than discrete systems; that
makes it possible to develop special-purpose systems that are more efficient than
general – purpose computers for the task at hand.



























Components of Chip:-

An Integrated Circuit (IC) is a combination of interconnected
circuit elements inseparably associated on or within a continuous substrate.

The substrate
is the supporting material upon or within which an IC is
fabricated or to which an IC is attached.








ECE-11








3



ECE-11


A monolithic IC is an IC whose elements are formed in place upon
or within a semiconductor substrate with at lease one of the elements formed
within the substrate.

A hybrid IC consists of a combination of two or more IC
types or an IC with some discrete elements.

A wafer (or slice)
is the basic physical unit used in processing. It
generally contains a large number of identical ICs, Typically,
the wafer is circular; production wafers have a diameter of
4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A
typical production wafer may contain as few as 20 or 30 ICs
or as many as several hundred or even several thousand,
depending upon the complexity and size of the circuit being
fabricated. The terms die and bar are used interchangeably
for chip in some companies.

A test plug, or process control bar (PCB),
or process control monitor (PCM), is a special chip
that is repeated only a few times on each wafer. It is used to
monitor the process parameters of the technology. After
processing, the validity of the process is verified by
measuring, at the wafer probe level, the characteristics of

devices and / or circuits on the test plug.

If the

measurements of key parameters at the test plug level are not
acceptable, the wafer is discarded. Front end construction of
components

A test cell, or test lead,
is a special chip repeated only a few times on each
wafer. It differs from the test plug in that the circuit
designer includes this cell specifically to monitor the
performance of elementary sub circuits or subcomponents


ECE-11













A
Technical
Paper presentation
On









[EC 04]
BY

D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786





















Accredited by NBA







ECE-11







1



ECE-11


ABSTRACT







































































ECE-11







































































2



ECE-11


VLSI
Very Large Scale Integrated Circuit




Why Design Integrated Circuits?

Integrated Circuit (IC) technology is the enabling technology for a
whole host of innovative devices and systems that have changed the way we live.
Integrated circuits are much smaller and consume less power than the discrete
components used to build electronic systems before the 1960s. Integration allows
us to build systems with many more transistors, allowing much more computing
power to be applied to solving a problem. Integrated circuits are also much easier
to design and manufacture and are more reliable than discrete systems; that
makes it possible to develop special-purpose systems that are more efficient than
general – purpose computers for the task at hand.



























Components of Chip:-

An Integrated Circuit (IC) is a combination of interconnected
circuit elements inseparably associated on or within a continuous substrate.

The substrate
is the supporting material upon or within which an IC is
fabricated or to which an IC is attached.








ECE-11








3



ECE-11


A monolithic IC is an IC whose elements are formed in place upon
or within a semiconductor substrate with at lease one of the elements formed
within the substrate.

A hybrid IC consists of a combination of two or more IC
types or an IC with some discrete elements.

A wafer (or slice)
is the basic physical unit used in processing. It
generally contains a large number of identical ICs, Typically,
the wafer is circular; production wafers have a diameter of
4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A
typical production wafer may contain as few as 20 or 30 ICs
or as many as several hundred or even several thousand,
depending upon the complexity and size of the circuit being
fabricated. The terms die and bar are used interchangeably
for chip in some companies.

A test plug, or process control bar (PCB),
or process control monitor (PCM), is a special chip
that is repeated only a few times on each wafer. It is used to
monitor the process parameters of the technology. After
processing, the validity of the process is verified by
measuring, at the wafer probe level, the characteristics of

devices and / or circuits on the test plug.

If the

measurements of key parameters at the test plug level are not
acceptable, the wafer is discarded. Front end construction of
components

A test cell, or test lead,
is a special chip repeated only a few times on each
wafer. It differs from the test plug in that the circuit
designer includes this cell specifically to monitor the
performance of elementary sub circuits or subcomponents
Reply
#42
hi
you can see these pages to get the details on optical-computer

http://studentbank.in/report-optical-com...t-download

http://studentbank.in/report-optical-com...oad?page=2

http://studentbank.in/report-optical-com...oad?page=4
Reply
#43

to get information about the topic optical computing full report ,ppt and related topic refer the page link bellow

http://studentbank.in/report-optical-com...ars-report

http://studentbank.in/report-optical-com...t-download

http://studentbank.in/report-optical-com...d-abstract

http://studentbank.in/report-seminars-re...technology

http://studentbank.in/report-optical-com...ort?page=2

http://studentbank.in/report-optical-computing--18053
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#44
hello Admin, can you help me by sending the total data of OPTICAL COMPUTERS even the related ppt (powerpoint presentation). actualy a every good frnd of mine is in need of that,, he has ppt on monday. so plzzz as soon as possible can u send me the data which i have asked u....
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#45
to get information about the topic "Optical Computer " full report ppt and related topic refer the page link bellow


http://studentbank.in/report-optical-com...t-download

http://studentbank.in/report-optical-com...nar-report

http://studentbank.in/report-optical-computing--18053

http://studentbank.in/report-optical-com...d-abstract

http://studentbank.in/report-optical-com...e=threaded

http://studentbank.in/report-fiber-optic...ull-report


http://studentbank.in/report-optical-com...ad?page=14
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#46
(19-04-2011, 11:00 AM)kuldeep221 Wrote: please sir ,give me report on optical computre

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#47
To get full information or details of Optical Computer Full Seminar Report Download please have a look on the pages

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