Nano copper wires interconnection for 3 dimensional integration in power electronics
#1

How to present ppt for this topic given the following abstract

A process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy and is a very promising candidate to favor three-dimensional integration in power electronics.
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#2

I think the data is available in the IEEE in the following link:
http://ieeexplore.ieeeXplore/login.jsp?r...ision=-203

you will have to download the article either through the institutional subscription of your college or the subscription of your friends. I'm sure, the article must be well organised into haedings. You will not find any difficulty in making a ppt once you have the report with you.
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