Abstract

Microvias are small holes in the range of 50 -100 µm. In most cases they are blind vias from the outer layers to the first innerlayer.
The development of very complex Integrated Circuits (ICs) with extremely high input/output counts coupled with the steadily increasing clock rates has forced the electronic manufacturer to develop new packaging and assembly techniques. Components with pitches less then 0.30 mm, chip scale packages, and flip chip technology are underlining this trend and highlight the importance of new printed wiring board technologies able to cope with the requirement of modern electronics.
In addition, more and more electronic devices have to be portable and consequently systems integration, volume and weight considerations are gaining importance.
These portables are usually battery powered resulting in a trend towards lower voltage power supplies, with their implication in PCB (Printed Circuit Board) complexity.
As a result of the above considerations, the future PCB will be characterized by very high interconnection density with finer lines and spaces, smaller holes and decreasing thickness. To gain more landing pads for small footprint components the use of microvias becomes a must.