heat pipe doc
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heat pipe doc

Abstract

With the continuing increase of CPU and system power dissipation requirements in personal computers, including notebooks, desktops, workstations and servers, the last three years have witnessed increasing use of and interest in heat pipes in personal computers to meet cooling requirements. The paper reviews heat pipe applications in notebook computers and high end systems. Heat pipe's main structure, components, and operation are briefly reviewed to give the readers the necessary background in heat pipes. In notebooks, heat pipe-to-keyboard thermal solutions have been the mainstream thermal solutions used in PentiumR based notebooks and sub-notebooks, providing about 7 W of CPU cooling solutions. New technologies like the thermal hinge concept, RHE (remote heat exchanger) thermal solutions and roll-bond heat pipes are also reviewed. Testing data on RHE prototypes showed that the technology can provide thermal resistance of 3.66°C/W from the CPU case to the outside ambient. In high performance systems, the conventional heat pipe heat sinks are reviewed first. The heat pipe lid/plate concept is then proposed and reviewed. The heat pipe lid is designed to be an extremely efficient heat spreader or plate and is being developed for high end cooling requirements. Testing data on early prototypes showed that they can achieve a level of 0.07°C/W spreading resistance for a ~3"×5" size heat pipe lid. Finally, the paper summarizes the future outlook of heat pipes for cooling of personal computers

Introduction

This paper will describe various cooling solutions in notebook PC and desktop/server applications. In the notebook PC application, miniature heat pipes of diameter 3-6 mm, flatten to desire thickness, are commonly used to improve heat spreading and more efficient transfer heat generated from the CPU to a remote heat dissipation area. Examples of three typical thermal solutions in notebook PC are given in this paper. Whereas in the desktop server application, flat type rectangular heat pipes or so-called vapor chambers are used to attach under the base of the heat sink to help temperature uniformity across the heat sink base. This will reduce the spreading resistance in the heat sink base and therefore improve the heat sink performance. Experimental results showed that with a vapor chamber installed can achieved a 45% improvement in the heat sink performance for heat sink of length 110 mm, width 72.5 mm, height 50 mm and base thickness 7 mm
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