Flip chip or Direct Chip Attach (DCA)
#1

In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performance, flexibility, reliability, and cost over other packaging methods. There are three stages in making flip chip assemblies: bumping the die or wafer, attaching the bumped die to the board or substrate, and, in most cases, filling the remaining space under the die with an electrically non-conductive material. Several varieties of flip chip assembly are solder bump, plated bump, gold stud bump, and adhesive bump suit flip chip which are used in a wide range of applications
Reply

Important Note..!

If you are not satisfied with above reply ,..Please

ASK HERE

So that we will collect data for you and will made reply to the request....OR try below "QUICK REPLY" box to add a reply to this page
Popular Searches: touch screen flip phone, flip script, www computer dca book pdf download free, full seminar report on flip chip, vlsi chip testing, seminar on dna chip, introduction to clockless chip,

[-]
Quick Reply
Message
Type your reply to this message here.

Image Verification
Please enter the text contained within the image into the text box below it. This process is used to prevent automated spam bots.
Image Verification
(case insensitive)

Possibly Related Threads...
Thread Author Replies Views Last Post
  APPLE – A Novel Approach for Direct Energy Weapon Control project topics 13 6,990 04-03-2013, 11:43 AM
Last Post: seminar details
  VLSI CHIP MAKING’S SINGULAR FUTURE seminar surveyer 2 1,982 12-03-2012, 10:27 AM
Last Post: seminar paper
Rainbow Diamond chip seminars report gunasagar 28 27,950 27-02-2012, 10:11 AM
Last Post: seminar paper
  Chip Morphing Technology Electrical Fan 30 23,000 25-02-2012, 10:22 AM
Last Post: seminar paper
  Micromechanical System For System-On-Chip Connectivity computer science crazy 1 3,115 24-01-2012, 10:41 AM
Last Post: seminar addict
  Micromechanical System for System-on-Chip Connectivity seminars report electronics seminars 2 3,444 24-01-2012, 10:41 AM
Last Post: seminar addict
Video three dimensional (3-D) chip design (download Report and ppt) computer science crazy 9 5,885 03-12-2011, 09:40 AM
Last Post: seminar addict
  IMPROVEMENT IN DIRECT TORQUE CONTROL(DTC) seminar class 1 1,933 04-08-2011, 02:20 PM
Last Post: gsc888
Lightbulb Flip chip Technology seminar projects crazy 3 4,059 13-05-2011, 02:47 PM
Last Post: seminar class
Thumbs Up diamond chip o carbon chip vijay kumarkm 3 4,057 09-04-2011, 04:36 PM
Last Post: project topics

Forum Jump: