ECE-11













A
Technical
Paper presentation
On









[EC 04]
BY

D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786





















Accredited by NBA







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ABSTRACT







































































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VLSI
Very Large Scale Integrated Circuit




Why Design Integrated Circuits?

Integrated Circuit (IC) technology is the enabling technology for a
whole host of innovative devices and systems that have changed the way we live.
Integrated circuits are much smaller and consume less power than the discrete
components used to build electronic systems before the 1960s. Integration allows
us to build systems with many more transistors, allowing much more computing
power to be applied to solving a problem. Integrated circuits are also much easier
to design and manufacture and are more reliable than discrete systems; that
makes it possible to develop special-purpose systems that are more efficient than
general – purpose computers for the task at hand.



























Components of Chip:-

An Integrated Circuit (IC) is a combination of interconnected
circuit elements inseparably associated on or within a continuous substrate.

The substrate
is the supporting material upon or within which an IC is
fabricated or to which an IC is attached.








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A monolithic IC is an IC whose elements are formed in place upon
or within a semiconductor substrate with at lease one of the elements formed
within the substrate.

A hybrid IC consists of a combination of two or more IC
types or an IC with some discrete elements.

A wafer (or slice)
is the basic physical unit used in processing. It
generally contains a large number of identical ICs, Typically,
the wafer is circular; production wafers have a diameter of
4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A
typical production wafer may contain as few as 20 or 30 ICs
or as many as several hundred or even several thousand,
depending upon the complexity and size of the circuit being
fabricated. The terms die and bar are used interchangeably
for chip in some companies.

A test plug, or process control bar (PCB),
or process control monitor (PCM), is a special chip
that is repeated only a few times on each wafer. It is used to
monitor the process parameters of the technology. After
processing, the validity of the process is verified by
measuring, at the wafer probe level, the characteristics of

devices and / or circuits on the test plug.

If the

measurements of key parameters at the test plug level are not
acceptable, the wafer is discarded. Front end construction of
components

A test cell, or test lead,
is a special chip repeated only a few times on each
wafer. It differs from the test plug in that the circuit
designer includes this cell specifically to monitor the
performance of elementary sub circuits or subcomponents