Electronics Seminar Topics List
hey the same topic asked and the answer given in several page see some of them

http://studentbank.in/report-moletronics...technology
http://studentbank.in/report-moletronics...525?page=2
http://studentbank.in/report-moletronics...logy--2525
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please send me seminor aboutmoletronics an invisible technology
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ppts and report of organic led
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to get information about the topic"organic led" refer the page link bellow

http://studentbank.in/report-organic-led-full-report

http://studentbank.in/report-organic-led...ort?page=2
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Speed Detection of moving vehicle using speed cameras


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I WOULD LIKE TO HAVE A PROJEST REPORT ON EMBEDED SYSTEMS
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Worldwide Inter operatibility for Microwave Access
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to get information about the topic"Worldwide Inter operatibility for Microwave Access"refer the page link bellow

http://studentbank.in/report-worldwide-i...ave-access
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please send more information about VLSI Computations.
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hi
you can refer these pages to get the details on vlsi computations

http://studentbank.in/report-vlsi-computations

http://studentbank.in/report-vlsi-for-ne...plications
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i need full detials of smart quill
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To get more information about the topic "smart quill " please refer the page link below


http://studentbank.in/report-smart-quill-full-report

http://studentbank.in/report-smart-quill...ort?page=3

http://studentbank.in/report-smart-quill...ort?page=2

http://studentbank.in/report-smart-quill...ort?page=4

http://studentbank.in/report-smart-quill--674
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hey, could you give me info about Wireless LED and thermal infrared imaging......ppt better Wink........
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pls send ppt of "MIMO-OFDM-Based Air Interface"
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EC2 TechnologyBig GrinBig GrinBig GrinBig GrinBig GrinBig GrinBig GrinBig GrinBig Grin
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15. Money Pad, The Future Wallet
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you can refer these pages to get the details on MONEY PAD THE FUTURE WALLET
http://studentbank.in/report-mo...ure-wallet

http://studentbank.in/report-mo...let?page=4

http://studentbank.in/report-mo...3#pid23793
http://studentbank.in/report-mo...?pid=20918
http://studentbank.in/report-mo...llet--5974
http://studentbank.in/report-mo...llet--6940
http://studentbank.in/report-mo...let--12744
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artificial immune system
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ECE-11













A
Technical
Paper presentation
On









[EC 04]
BY

D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786





















Accredited by NBA







ECE-11







1



ECE-11


ABSTRACT







































































ECE-11







































































2



ECE-11


VLSI
Very Large Scale Integrated Circuit




Why Design Integrated Circuits?

Integrated Circuit (IC) technology is the enabling technology for a
whole host of innovative devices and systems that have changed the way we live.
Integrated circuits are much smaller and consume less power than the discrete
components used to build electronic systems before the 1960s. Integration allows
us to build systems with many more transistors, allowing much more computing
power to be applied to solving a problem. Integrated circuits are also much easier
to design and manufacture and are more reliable than discrete systems; that
makes it possible to develop special-purpose systems that are more efficient than
general – purpose computers for the task at hand.



























Components of Chip:-

An Integrated Circuit (IC) is a combination of interconnected
circuit elements inseparably associated on or within a continuous substrate.

The substrate
is the supporting material upon or within which an IC is
fabricated or to which an IC is attached.








ECE-11








3



ECE-11


A monolithic IC is an IC whose elements are formed in place upon
or within a semiconductor substrate with at lease one of the elements formed
within the substrate.

A hybrid IC consists of a combination of two or more IC
types or an IC with some discrete elements.

A wafer (or slice)
is the basic physical unit used in processing. It
generally contains a large number of identical ICs, Typically,
the wafer is circular; production wafers have a diameter of
4,5 or 6 in. The chip is one of the repeated ICs on a wafer. A
typical production wafer may contain as few as 20 or 30 ICs
or as many as several hundred or even several thousand,
depending upon the complexity and size of the circuit being
fabricated. The terms die and bar are used interchangeably
for chip in some companies.

A test plug, or process control bar (PCB),
or process control monitor (PCM), is a special chip
that is repeated only a few times on each wafer. It is used to
monitor the process parameters of the technology. After
processing, the validity of the process is verified by
measuring, at the wafer probe level, the characteristics of

devices and / or circuits on the test plug.

If the

measurements of key parameters at the test plug level are not
acceptable, the wafer is discarded. Front end construction of
components

A test cell, or test lead,
is a special chip repeated only a few times on each
wafer. It differs from the test plug in that the circuit
designer includes this cell specifically to monitor the
performance of elementary sub circuits or subcomponents
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please send the information
Moletronics- an invisible technology

please send the information soon
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hiii..i need the full details for the topics :

Investigation of the types of handovers in wireless communication system,
indoor Positioning,Fuel Cell Vehicle,NIGHT VISION TECHNOLOGY,Wafer Bumping ,Smart Home Technologies,. Radar Tracking System : Concept and Application, Electronic Cooling Systems ,Electronic Paper Display ,
Blue laser,SMATV system,Electronic Nose
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to get information about the topic"wireless communication system," refer the page link bellow

http://studentbank.in/report-wireless-co...ull-report
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Fpga offloads dsp?s.
Fpga offloads dsp?s.
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Fpga offloads dsp?s.

can i get a brief seminar on any of the related topics..pls
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Light emitting polymers,nokia-morph-technology,Money Pad, The Future Wallet
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