Electroosmotic Microchannel Cooling System
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size.memory, video, and power-delivery components have to be placed away from the microprocessor due to the large volume of existing heat sinks increasing signal delays among chips and limiting the system speed.
A Stanford research team is using MEMS technology to explore the lower bound volume for the heat sink.two-phase convection in micromachined silicon heat sinks is combined with a novel electroosmotic pump to achieve minimal heat sink volume at the chip backside. The electroosmotic pump forced two-phase convection in the heat sink, and a remote heat rejecter.
The electroosmotic microchannel cooling system implemented in a laptop computer:
Here, A 1 cm x 1 cm silicon microchannel heat exchanger is attached to the processor. The rejecter coil and plate are located at the backside of the display panel.making use of the power supply for the fan with a converter, An EO pump propels water through the loop. a peak heat flux exceeding 100 W/cm2 and a total load of more than 130W can be handled by it.
the lack of a compact, reliable pumping technology with the necessary pressure and flowrate characteristics limited the microchannel cooling technology. In the Electroosmotic pump, an external electric field through a microporous glass frit is made use of to move ions within the bulk liquid, and simple ion drag creates a net motion of the bulk liquid.
for more details visit these pages:
http://electronics-cooling2002/11/electroosmotic-microchannel-cooling-system-for-microprocessors/
http://microfluidics.stanford.edu/Public...0Trans.pdf
http://studentbank.in/report-metal-coole...46#pid6946
