16-01-2018, 12:07 PM
16-01-2018, 01:03 PM
abstract
Plastic substrates are thin, lighter, shutterproof, flexible, rollable and foldable, making silicone-on-plastic an advanced technology for new applications / products. This paper studies the development of silicon on plastic technology. Advances in poly-silicon technology have expanded TFT (Thin Film Transistor) technology for high-speed electronic applications such as smart card, RFID tag, portable imaging device, photo-voltaic device and solid state lighting and other integrated circuit functions. The challenge of silicon-on-plastic technology is to overcome the fact that the plastic melts at the temperature required to make transistors in conventional TFT processes. Technical innovation has been made to accommodate silicon processing at low temperatures. T has described an innovative ultra-low temperature poly-silicon TFT process on plastic substrates in its paper, the main technologies include room-temperature silicon and oxide deposition movements, laser crystallization and dopant activation. Manufacturing issues related to plastic material compatibility are reviewed in the TFT process. The lamination and bleaching of plastic wafers of glass carrier wafers have been discussed for the manufacurability. An active matrix TFT backplane will be produced with an OLED (Organic Light Emitting Diode) display to demonstrate this technique.
Plastic substrates are thin, lighter, shutterproof, flexible, rollable and foldable, making silicone-on-plastic an advanced technology for new applications / products. This paper studies the development of silicon on plastic technology. Advances in poly-silicon technology have expanded TFT (Thin Film Transistor) technology for high-speed electronic applications such as smart card, RFID tag, portable imaging device, photo-voltaic device and solid state lighting and other integrated circuit functions. The challenge of silicon-on-plastic technology is to overcome the fact that the plastic melts at the temperature required to make transistors in conventional TFT processes. Technical innovation has been made to accommodate silicon processing at low temperatures. T has described an innovative ultra-low temperature poly-silicon TFT process on plastic substrates in its paper, the main technologies include room-temperature silicon and oxide deposition movements, laser crystallization and dopant activation. Manufacturing issues related to plastic material compatibility are reviewed in the TFT process. The lamination and bleaching of plastic wafers of glass carrier wafers have been discussed for the manufacurability. An active matrix TFT backplane will be produced with an OLED (Organic Light Emitting Diode) display to demonstrate this technique.