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Ivy Bridge is the key name for a line of third generation processors based on the 22 nm manufacturing process developed by Intel. The name also applies more broadly to the 22 nm contraction of the Sandy Bridge microarchitecture based on Tri-Gate FinFET ("3D") transistors, which is also used in Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy The Bridge-EP and Ivy Bridge-E microprocessors launched in 2013.
Ivy Bridge processors are compatible with the Sandy Bridge platform, but such systems may require a (vendor-specific) firmware upgrade. In 2011, Intel launched the Series 7 Panther Point chipsets with integrated USB 3.0 to complement Ivy Bridge.
Volume production of Ivy Bridge chips began in the third quarter of 2011. Four-core and dual-core models were launched on 29 April 2012 and 31 May 2012 respectively. Core i3 desktop processors, as well as the first 22nm Pentium, were announced and are available the first week of September 2012. It is Intel's latest microarchitecture for which there is compatibility with the Windows XP driver.
Ivy Bridge temperatures are reported to be 10 ° C higher than those of Sandy Bridge when a CPU is overclocked, even with the default voltage setting. Impress PC Watch, a Japanese website, performed experiments that confirmed previous speculation that this was because Intel used a low-quality (and perhaps lower-cost) thermal interface material (thermal paste or "TIM") between the chip and the thermal diffuser. of the fluxless welding of previous generations. Ivy Bridge mobile processors are not affected by this problem because they do not use a heat exchanger between the chip and the cooling system.
Enthusiastic reports describe the TIM used by Intel as low quality, and it is not up to a "premium" CPU, with some speculation that this is by design to encourage sales of previous processors. Other analyzes warn that the processor may be damaged or void if the home users try to remedy the problem. The TIM has a much lower thermal conductivity, which causes the heat to be trapped in the matrix. Experiments with the replacement of this TIM with a higher quality or other heat removal methods showed a substantial drop in temperature and improvements in increased voltages and overclocking sustained by the Ivy Bridge chips.
Intel claims that the smaller die of Ivy Bridge and the related increase in thermal density are expected to cause higher temperatures when the CPU is overlapped; Intel also said that this is expected and will probably not improve in future revisions.